Highlighting the role of India’s young talent in the technology sector, Union Minister of Electronics & Information Technology Ashwini Vaishnaw noted that 20 indigenous student-designed semiconductor chips have been successfully fabricated at the Semi-Conductor Laboratory (SCL) in Mohali.

In a social media post, the minister stated, “Bharat’s Yuva Shakti, 20 indigenous student-designed chips taped out from SCL Mohali.”

According to the Ministry of Electronics & IT, these chips were designed by students from 17 Indian engineering institutions, including several IITs, and successfully fabricated at its facility.

These designs are part of the Design Linked Incentive (DLI) Scheme, which aims to strengthen semiconductor design and manufacturing capabilities in India.

The ministry further added that the DLI Scheme, approved with an outlay of Rs 1,000 crore, supports domestic companies, startups, and MSMEs in designing semiconductor products.

Designing and commercializing semiconductor products involves high entry barriers, long development timelines, and intense global competition.

To address these challenges, the DLI Scheme offers design infrastructure support, such as Electronic Design Automation (EDA) tools and Intellectual Property (IP) cores, for early prototyping.

It also provides financial incentives of up to 50 per cent of eligible costs, capped at Rs 15 crore per application, for design prototyping, scaling up, and volume production.

Additionally, there are incentives of 6 to 4 per cent of net sales turnover over five years, capped at Rs 30 crore per application, for deployment and commercialization of chip solutions.

Since its launch in December 2021, 278 academic institutions under the C2S programme and 72 startups under the DLI scheme have been approved for access to advanced EDA tools.

The ministry stated “The DLI Scheme is implemented in close consultation with stakeholders and beneficiary companies. Any modifications needed will be done based on evolving requirements and feedback”.

The ministry also noted that financial support has been sanctioned to 23 firms and startups for designing chips for applications such as surveillance cameras, energy meters, microprocessor IPs, and networking.

Of these, ten companies have secured venture capital funding to scale up their prototypes for commercialization, while six companies have completed prototype tape-outs at various semiconductor foundries. (Economic Times)

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Apple said on Wednesday that Samsung Electronics will supply chips from its production plant in Austin, Texas, for Apple products, including iPhones.

“This facility will supply chips that optimise power and performance of Apple products, including iPhone devices,” Apple said in a statement.

A Samsung spokesperson declined to comment.

The statement was made as part of Apple’s announcement that it would spend an additional $100 billion in U.S. investments, bringing its total investment commitment to the country to $600 billion over the next four years.

“What’s significant is that Samsung is taking over some of the image sensor volumes that Apple previously sourced from Sony,” said Ryu Young-ho, a senior analyst at NH Investment & Securities.

“Since Sony only makes image sensors in Japan, Apple appears to be diversifying its suppliers and localising production in the United States.”

Ryu said that while Sony still dominates the high-end image sensor market, Apple’s move reduces its reliance on a single vendor and supports its push for more U.S.-based sourcing.

Tesla recently signed a $16.5 billion deal to source chips from Samsung, with Tesla CEO Elon Musk saying in late July that Samsung’s new chip factory in Texas would make Tesla’s next-generation AI6 chip.

Samsung’s chip contract manufacturing business is expected to reduce losses by securing new orders in 2026 to make image sensor chips for iPhone 18s and chips for Tesla, Pak Yuak, analyst at Kiwoom Securities, wrote in a note late last month. (Reuters)

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